HeidelbergCement plans bond issue
HeidelbergCement plans to issue a benchmark non-subordinated bond comprised of two tranches of at least EUR500m (US$726.8m) each, maturing in 2015 and 2020, respectively.
"The proceeds from the issue will be used exclusively for the partial repayment of a syndicated loan. The maturity profile of the group’s liabilities will therefore be extended out further and improved," the company said in a statement late on Monday.
Published under Cement News
